Why ATEX Certification Fails: Common Intrinsically Safe Design Mistakes
Most ATEX submissions fail for the same five reasons. Here’s what notified bodies actually reject, and how to catch it before you submit.
Do You Need an AI SBOM? 5 Questions Embedded Teams Are Asking
What is an AI SBOM and do you need one? A ByteSnap Design engineer answers 5 practical queries on model tracking, CRA compliance & where to start.
Is Edge AI Production Ready?
Short answer: yes, for the right applications. ByteSnap Design co-founder Dunstan Power gives his honest take on where edge AI is genuinely production-ready and where caution still applies.
Is Edge AI right for your product? An Engineer’s View
Edge AI isn’t right for every product. ByteSnap’s Dunstan Power sets out the main questions that give you a clear answer before you commit any budget.
Energy Harvesting for Industrial IoT: 2026 Engineer’s Guide
Self-powered IIoT sensors: indoor light harvesting now 32-38% efficient, hybrid systems, LoRaWAN. Feasibility calculations & wireless protocol comparison.
Designing Firmware for Secure OTA Updates – Without Bricking Your Device
How to handle power loss, verify package integrity, and design a bootloader that recovers – not bricks.
Choosing the Right Cellular Standard for Your IoT Device
No single cellular standard suits every IoT product. Our expert guide compares NB-IoT, LTE Cat-M1, and Cat-1 bis to help you choose the right one before you design it in.
Why Your 2G 3G Migration Project Is Still on Hold 8 Months Later
⏩ TL;DR: Cellular migrations typically overrun because teams underestimate antenna redesign complexity, certification requirements, and the specific RF expertise needed to move beyond “pin-compatible” module swaps. While internal teams often plan for four months, the specialist capability gap usually turns that into an 18-month reality. Partnership with specialists compresses this back to a 4-6 month […]
DRAMageddon: Why your embedded product is now competing with Google for memory
DRAM prices rose 172% in 2025. If your product runs on DDR4 or DDR5, your BOM is already under pressure. Dunstan Power on what UK embedded manufacturers can do right now.
ATEX vs IECEx: Choosing the Right Global Certification Strategy
ATEX vs IECEx in 2026: Expert guide for UK technical directors on indefinite CE recognition, global market access, and dual-certification costs.