Author: Dan Lees

Dan is a hardware engineer at ByteSnap Design with a background in test equipment design. He specialises in PCB design, schematic design, ATEX, and compliance work and has been involved in a range of projects spanning cellular migration, IoT and industrial electronics since joining the team in 2022. Outside of engineering, Dan is a stand-up comedy and music enthusiast and is always open to new listening recommendations.

Why Your 2G 3G Migration Project Is Still on Hold 8 Months Later

Cellular migration antenna redesign

⏩ TL;DR: Cellular migrations typically overrun because teams underestimate antenna redesign complexity, certification requirements, and the specific RF expertise needed to move beyond “pin-compatible” module swaps. While internal teams often plan for four months, the specialist capability gap usually turns that into an 18-month reality. Partnership with specialists compresses this back to a 4-6 month […]

Spotting and Solving Problems: Circuit Board Bring-up Issues

What You’ll Learn Systematic inspection techniques to identify common PCB issues before powering up, preventing costly damage to components   Safe power-up procedures using bench supplies and thermal monitoring to detect problems early in the testing process   Programming and debugging strategies for integrated circuits, including voltage level matching and timing requirements   Fault isolation […]