How We Engineered the WAND HDC for Next Gen Performance

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TL;DR - WAND HDC Redesign Project

  • What is the WAND Handheld Data Collector [WAND HDC]?

    The WAND HDC is a third-generation handheld sensor for precise, non-invasive pipe wall thickness monitoring by Inductosense.

  • How did ByteSnap Design improve the device?

    ByteSnap Design's engineering consultants completely redesigned the core electronics to deliver lower unit costs, dramatically improved operating speeds, and extended battery life. We also enhanced high-speed communications, improved the user interface, and met the latest IoT cybersecurity requirements.

  • What problem does WAND HDC solve?

    It provides continuous, accurate monitoring of internal corrosion and erosion to enable predictive maintenance and prevent costly unplanned shutdowns of industrial assets.

Contents

A Breakthrough in Industrial IoT, Powered by British Engineering


Developed in collaboration with King’s Award for Innovation winner, Inductosense, the revolutionary third-generation WAND Handheld Data Collector (WAND HDC) represents a quantum leap in pipe wall thickness monitoring technology.

Building on the success of the ELEKTRA 2022 IoT Product of the Year-winning WAND RDC, we worked with Inductosense to create one of the most advanced handheld industrial sensors of its generation.

This project showcases how our embedded systems mastery, applied to Inductosense’s patented sensing innovation, continues to drive global industrial IoT advancement through British engineering excellence.

WAND HDC - image credit, Inductosense
WAND HDC - image credit, Inductosense

How Our Expertise Delivered a "Quantum Leap" in Performance

ByteSnap Design is one of the UK’s leading electronics engineering consultancies.

Our award-winning engineering capabilities, spanning embedded Linux, FPGA development, IoT cybersecurity, and ultra-low power design, were instrumental in delivering the performance breakthroughs that define this third-generation device.

The collaboration between Inductosense’s first-class sensing innovation and our embedded engineering mastery produced something truly exceptional.

 

  • What Were the Core Engineering Challenges of the WAND HDC Redesign?

    The goal of the WAND HDC redesign was to take an already exceptional product and improve nearly every aspect of its performance.

    While Inductosense's core technology for precise, non-invasive pipe wall thickness measurements using wireless ultrasonic sensors was a breakthrough, our task was to redesign the electronics and core cartridge to deliver the performance upgrades that today's industrial environments demand.

    The comprehensive redesign transformed virtually every aspect of the device's performance. The project's key challenges included:

    • Optimising Performance: We had to dramatically improve operating speeds, extend battery life, and enhance high-speed communications.
    • Enhancing the User Experience: We needed to create an intuitive new user interface that made the device more efficient to use in the field.
    • Meeting Modern Standards: We had to meet the latest IoT cybersecurity requirements, which are increasingly critical for industrial deployments.
    • Improving the Bill of Materials: The redesign had to deliver lower unit costs without compromising on quality or performance.
"This third-generation device wouldn't exist without ByteSnap Design's technical excellence in electronics design and their deep understanding of what industrial environments demand".
Dr. Chenghuan Zhong
Founder and Chief Technology Officer at Inductosense
WAND HDC - image credit, Inductosense
WAND HDC - image credit, Inductosense

Critical Infrastructure Monitoring Upgraded: The Impact

The WAND HDC by Inductosense addresses the escalating challenges of industrial asset management, where internal corrosion and erosion are major operational risks.

Unlike traditional manual inspection methods, the WAND system provides continuous, accurate monitoring that enables predictive maintenance and helps prevent costly unplanned shutdowns.

The device’s enhanced capabilities make it ideal for monitoring critical infrastructure across sectors including energy, utilities, and manufacturing, where precise wall thickness data can be the difference between safe operation and catastrophic failure.

A Partnership of Excellence

The WAND HDC project represents more than an advance in technology. 

It shows how our engineering excellence helps to transform breakthrough innovations into market-leading solutions, solving real-world industrial challenges through collaborative British engineering.

Ultrasonic sensor design project - FAQs

  • Who is Inductosense?

    Inductosense is a King's Award for Innovation winner. The company was founded in 2015 as a University of Bristol spin-out and now employs over 40 people. Inductosense designs and manufactures wireless, battery-free ultrasonic sensors for monitoring internal corrosion, cracks, and erosion.

  • What is the WAND RDC?

    The WAND RDC [Remote Data Collector] is the predecessor to the WAND HDC. It won the ELEKTRA 2022 IoT Product of the Year award.

  • What are the key features of the WAND HDC?

    The third-generation WAND HDC delivers lower unit costs, improved operating speeds, extended battery life, enhanced high-speed communications, and an intuitive new user interface. It also meets the latest IoT cybersecurity requirements.

  • Why is IoT cybersecurity so important for industrial devices?

    Industrial IoT devices play a central role in operations, and their data must be protected. Meeting the latest cybersecurity requirements strengthens the device's resilience and protects against potential threats in a connected industrial environment.

  • How does the device perform non-invasive measurements?

    The WAND HDC uses Inductosense's patented wireless ultrasonic sensor technology to take precise, non-invasive pipe wall thickness measurements.

  • How does this design partnership showcase British engineering?

    The project demonstrates the power of British engineering collaboration, combining Inductosense's innovation with ByteSnap Design's embedded systems expertise to create a world-class solution.

Ready to Engineer Your Own Breakthrough?

We love solving tough engineering challenges. If you have a project that needs world-class embedded systems expertise, get in touch to find out how we can help.
ByteSnap Editorial Team

Founded in 2008, ByteSnap Design is an award-winning embedded systems design consultancy, offering a comprehensive range of services across the electronic product development lifecycle.

A highly skilled team of over 40 hardware and software engineers, our expertise spans several sectors, including IoT, automotive, industrial, medical, and consumer electronics.

The engineering consultants on the ByteSnap Editorial Team share their knowledge and practical tips to help you streamline your product development and accelerate designs to market successfully.

With their deep technical expertise and practical experience, they aim to provide valuable insights and actionable tips to guide you through the complex world of electronic product design and development, to help you bring innovative, reliable, and secure electronic products to market quickly and cost-effectively.

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