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Embedded Firmware Development
NXP Processor Development – i.MX7ULP
Windows Embedded CE End of Life Support & Migration Services
Windows CE & Mobile BSP Design
Android Application Development
iPhone Application Development
Electronic Design
Electronic Board Design
Redesign Service
FPGA Development
Electronic Prototype Design
Low Power Wireless Design
ATEX Product Design Services
Manufacturing Support
NXP Gold Partner
Design Partners
Solutions
Automated Electronic Product Design Service
Design Rescue Service: Fixing Electronics and Software Product Designs
Feasibility Study
OpenTherm Development Services | Smart Heating
Markets
Automotive & Rail
Energy
Industrial
Internet of Things & M2M
Logistics
Marine
Medical Devices & Healthcare
Scientific
Smart Home
Products
SnapUI User Interface Development Tool
Charging Point Solutions | Software Development & Electronic Design
Smart Charge Point Communications Controller
Charging Points | EVSE & Smart Charge Point Solutions
Charging Points: OCPP & Software Licensing
ZigBee Control & Metering Modules
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About ByteSnap Design
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Innovative Remote Monitoring System at Railtex 2015
ByteSnap unveils low-power monitoring for rail industry
Five advantages of pre-compliance EMC testing
Microsoft @ 40: A Closer Look at Embedded Compact 6.0 Part 2
Microsoft @ 40: A Closer Look at Embedded Compact 6.0
IoT Security and the Cost-to-Care Ratio
Extra Terrestrial Spotted
ByteSnap’s Custom Electronic Design Team at Railtex 2015
ByteSnap Achieves ISO 9001 Certification
ByteSnap logistics app helps to track vehicles
UK Eclipse Fever Hits Electronic Design Engineers
CE marking – 20 things you need to know
Assessing technical design trade-offs - key criteria for the design engineer
EMC Testing Services Now at ByteSnap
Design trade-offs in M2M product design and development
ByteSnap on harvested energy in the IoT (Podcast)
Install Android 4.4 with Play Store on Wandboard in 7 Steps
Happy Christmas from ByteSnap's Electronic Design Team
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